DocumentCode
1864097
Title
The challenge of GaAs IC manufacturing in Taiwan for Asian Pacific wireless market
Author
Yang, L.W. ; Chao, P.C. ; Wu, L.
Author_Institution
RF Integrated Corp., Irvine, CA, USA
fYear
2001
fDate
21-24 Oct. 2001
Firstpage
15
Lastpage
18
Abstract
The authors consider the market perspectives of the Asia Pacific area, describe a business model based on the track records of silicon IC manufacturing, and highlight technology challenges.
Keywords
III-V semiconductors; electronics industry; gallium arsenide; integrated circuit economics; integrated circuit manufacture; integrated circuit technology; Asia Pacific wireless market; GaAs IC manufacturing; Taiwan; business model; market perspectives; technology challenges; Cellular phones; Costs; Foundries; Gallium arsenide; Heterojunction bipolar transistors; Integrated circuit modeling; Manufacturing industries; Mass production; Semiconductor device manufacture; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
Conference_Location
Baltimore, MD, USA
ISSN
1064-7775
Print_ISBN
0-7803-6663-8
Type
conf
DOI
10.1109/GAAS.2001.964336
Filename
964336
Link To Document