DocumentCode
1864870
Title
Compound semiconductor physical device simulation for technology development at Motorola
Author
Hartin, O.L. ; Ray, M. ; Li, P. ; Johnson, K.
Author_Institution
Motorola Inc., Tempe, AZ, USA
fYear
2001
fDate
21-24 Oct. 2001
Firstpage
163
Lastpage
165
Abstract
There is significant advantage to simulation-assisted device development in compound semiconductors At Motorola, 2D and 3D physics-based TCAD is heavily integrated into device development for communications. Effective simulation methods have been developed that allow us to reduce development cycle time, and cycles of learning to achieve cost competitive III-V market leading technologies. Our methodology includes analytical analysis, calibration to measured data, parameter study, and optimization of DC, small signal AC, RF, and thermal performance. This methodology has been used in pHEMT, HBT, and HIGFET development Application development, such as the pHEMT-based RF switch, has also used device simulation heavily. The fundamentals of this methodology will be discussed and examples from the technology areas will be presented.
Keywords
III-V semiconductors; semiconductor device models; technology CAD (electronics); 2D TCAD; 3D TCAD; AC characteristics; DC characteristics; HBT; HIGFET; III-V compound semiconductor; Motorola technology; RF characteristics; RF switch; analytical analysis; calibration; communications applications; development cycle time; learning cycle; optimization; pHEMT; parameterization; physical device simulation; small-signal characteristics; thermal properties; Calibration; Costs; III-V semiconductor materials; Optimization methods; PHEMTs; Performance analysis; RF signals; Radio frequency; Signal analysis; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
Conference_Location
Baltimore, MD, USA
ISSN
1064-7775
Print_ISBN
0-7803-6663-8
Type
conf
DOI
10.1109/GAAS.2001.964369
Filename
964369
Link To Document