• DocumentCode
    1865761
  • Title

    Parylene to silicon adhesion enhancement

  • Author

    Huang, R. ; Tai, Y.C.

  • Author_Institution
    Micromachining Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1027
  • Lastpage
    1030
  • Abstract
    Parylene-C has been used extensively in neural interface devices as a conformal, biocompatible coating; it has also recently become an integrated part of our parylene-cabled silicon probes. However, it is found over the years that its adhesion capability to silicon may be compromised after thermal treatments, cleaning, handling, bench testing and implantations. This paper explores extensively new techniques including annealing, melting, anchoring, and XeF2 silicon surface roughening to enhance this adhesion. We report the first quantitative experimental data on the effectiveness of each through tearing, soaking, etching and ASTM peeling tests. The results show various improved adhesion means over the standard A-174 adhesion promotion, which can greatly benefit the use of parylene.
  • Keywords
    adhesion; annealing; biomedical materials; materials testing; melting; packaging; silicon; surface roughness; Si; XeF2; anchoring; annealing; biocompatible coating; etching; melting; parylene-C; peeling; silicon adhesion; soaking; surface roughening; tearing; temperature 200 degC; Adhesives; Annealing; Cleaning; Coatings; Probes; Rough surfaces; Silicon; Surface roughness; Surface treatment; Testing; Adhesion; CVD thin-film; Packaging; Parylene-C;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285963
  • Filename
    5285963