DocumentCode
1865761
Title
Parylene to silicon adhesion enhancement
Author
Huang, R. ; Tai, Y.C.
Author_Institution
Micromachining Lab., California Inst. of Technol., Pasadena, CA, USA
fYear
2009
fDate
21-25 June 2009
Firstpage
1027
Lastpage
1030
Abstract
Parylene-C has been used extensively in neural interface devices as a conformal, biocompatible coating; it has also recently become an integrated part of our parylene-cabled silicon probes. However, it is found over the years that its adhesion capability to silicon may be compromised after thermal treatments, cleaning, handling, bench testing and implantations. This paper explores extensively new techniques including annealing, melting, anchoring, and XeF2 silicon surface roughening to enhance this adhesion. We report the first quantitative experimental data on the effectiveness of each through tearing, soaking, etching and ASTM peeling tests. The results show various improved adhesion means over the standard A-174 adhesion promotion, which can greatly benefit the use of parylene.
Keywords
adhesion; annealing; biomedical materials; materials testing; melting; packaging; silicon; surface roughness; Si; XeF2; anchoring; annealing; biocompatible coating; etching; melting; parylene-C; peeling; silicon adhesion; soaking; surface roughening; tearing; temperature 200 degC; Adhesives; Annealing; Cleaning; Coatings; Probes; Rough surfaces; Silicon; Surface roughness; Surface treatment; Testing; Adhesion; CVD thin-film; Packaging; Parylene-C;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285963
Filename
5285963
Link To Document