• DocumentCode
    1869970
  • Title

    Micromechanical robustness tests of 28nm BEOL layer stacks

  • Author

    Langer, Eckhard ; Geisler, Holm

  • Author_Institution
    GLOBALFOUNDRIES LLC & Co. KG, Dresden, Germany
  • fYear
    2015
  • fDate
    June 29 2015-July 2 2015
  • Firstpage
    488
  • Lastpage
    491
  • Abstract
    The paper describes two micromechanical stress tests, which evaluate the robustness of Back End Of Line (BEOL) layer stacks under mechanical stress, by applying bending stress to FIB prepared pillars and by using nanoindentation in previously prepared cross sections. Conclusions about mechanical robustness of BEOL integration schemes and particular design features are drawn.
  • Keywords
    bending strength; focused ion beam technology; materials testing; nanoindentation; BEOL layer stacks; FIB prepared pillars; back end of line layer stacks; bending stress; micromechanical robustness test; micromechanical stress test; nanoindentation; size 28 nm; Adhesives; Integrated circuit interconnections; Metallization; Robustness; Silicon; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
  • Conference_Location
    Hsinchu
  • Type

    conf

  • DOI
    10.1109/IPFA.2015.7224439
  • Filename
    7224439
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1869970