DocumentCode
1871315
Title
Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique
Author
Keshavarzi, Shervin ; Mescheder, Ulrich ; Reinecke, Holger
Author_Institution
Inst. of Appl. Res. (IAF), Furtwangen Univ.Furtwangen, Furtwangen, Germany
fYear
2015
fDate
18-22 Jan. 2015
Firstpage
413
Lastpage
416
Abstract
This work presents a bonding mechanism between needle-like surfaces for room temperature Si-Si direct bonding similar to the Velcro-principle, a fully CMOS compatible approach suitable for system integration using Si-motherboard concept. The proposed bonding model is superior to other presented models since it considers humidity effect and the deformation mechanism of the needles during the bonding.
Keywords
CMOS integrated circuits; elemental semiconductors; integrated circuit bonding; low-temperature techniques; silicon; Si-Si; Si-motherboard concept; Velcro concept Si-Si low temperature direct bonding technique; bonding mechanism; deformation mechanism; fully CMOS compatible approach; humidity effect; needle-like surfaces; room temperature Si-Si direct bonding; temperature 293 K to 298 K; Bonding; Force; Needles; Silicon; Substrates; Surface morphology; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location
Estoril
Type
conf
DOI
10.1109/MEMSYS.2015.7050977
Filename
7050977
Link To Document