DocumentCode
1872788
Title
Physical and chemical constraints on the application of rapid thermal processing to the deposition and post-deposition processing of alternative high-k gate dielectrics
Author
Lucovsky, Gerald
Author_Institution
Dept. of Phys., North Carolina State Univ., Raleigh, NC, USA
fYear
2001
fDate
2001
Firstpage
43
Lastpage
61
Abstract
This paper discusses the amorphous morphology and electronic structure of elemental and binary oxides that have been proposed as alternative gate dielectrics for advanced Si CMOS devices. Based on fundamental aspects of amorphous morphology and electronic structure, binary alloys comprised of transition metal and rare earth oxides such as Zr(Hf)O2 and Y(Gd)2O3, and either SiO2 or Al2O3 are identified as leading contenders for the first generation of advanced replacement dielectrics. This paper also addresses issues relative to deposition of these materials and their integration into CMOS devices.
Keywords
CMOS integrated circuits; amorphous state; dielectric thin films; elemental semiconductors; integrated circuit technology; permittivity; rapid thermal processing; silicon; vapour deposited coatings; vapour deposition; Al2O3; Gd2O3; HfO2; RTP; Si; Si CMOS devices; SiO2; Y2O3; Y2O3-Gd2O3; ZrO2; ZrO2-HfO2; amorphous morphology; binary oxides; chemical constraints; dielectric material deposition; electronic structure; elemental oxides; high-k gate dielectrics; physical constraints; post-deposition processing; rapid thermal processing; rare earth oxides; transition metal; Amorphous materials; Chemical processes; Crystallization; Dielectric devices; Dielectric materials; High-K gate dielectrics; Morphology; Rapid thermal processing; Silicon alloys; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001
Print_ISBN
0-9638251-0-4
Type
conf
DOI
10.1109/RTP.2001.1013743
Filename
1013743
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