DocumentCode
1873048
Title
Some factors that affect performance of capillary flip chip underfills
Author
Edwards, Maury
Author_Institution
Dexter Electron. Mater., CA, USA
fYear
1998
fDate
15-18 Mar 1998
Firstpage
21
Lastpage
28
Abstract
Not all capillary flip chip underfill materials are created equal. Differences that affect performance that frequently do not appear on product information sheets will be discussed. Data such as adhesion to different surfaces and flow rates will be compared for various underfill formulations. Some process variables will also be discussed
Keywords
adhesion; capillarity; encapsulation; flip-chip devices; integrated circuit packaging; viscosity; adhesion; capillary flip chip underfills; flow rates; process variables; underfill formulations; Adhesives; Electronics industry; Flip chip; Industrial electronics; Material properties; Packaging; Passivation; Sheet materials; Testing; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-4795-1
Type
conf
DOI
10.1109/ISAPM.1998.664428
Filename
664428
Link To Document