DocumentCode
1873305
Title
Microvia technology in MCM-D/L-need, challenge, and response
Author
Li, Weipmg ; Tummala, Rao
Author_Institution
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1998
fDate
15-18 Mar 1998
Firstpage
60
Lastpage
62
Abstract
This paper discusses the performance and cost needs of high-density wiring substrates and the challenges to the materials and processes of MCM-D/L technology. The approach proposed by the Packaging Research Center (PRC) at Georgia Tech to meet these needs and challenges is presented along with some up-to-date advances in microvia technology. Finally, further research and development planned on microvia technology is presented
Keywords
integrated circuit interconnections; integrated circuit packaging; multichip modules; wiring; Georgia Tech; IC interconnections; MCM-D/L; Packaging Research Center; high-density wiring substrates; microvia technology; Calendars; Costs; Drives; Electronics industry; Nonhomogeneous media; Packaging; Partial response channels; Substrates; Transistors; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-4795-1
Type
conf
DOI
10.1109/ISAPM.1998.664434
Filename
664434
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