• DocumentCode
    1873757
  • Title

    Effect of growth and annealing conditions on interface charge of dry and wet oxides grown using rapid thermal oxidation

  • Author

    Sharangpani, R. ; Tay, Sing-Pin

  • Author_Institution
    Mattson Thermal Products Inc., San Jose, CA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    273
  • Lastpage
    286
  • Abstract
    In this paper we compare fixed and interface trapped charges of dry and wet oxides processed under different conditions. As-grown wet oxides demonstrate a significantly lower density of interface traps (Dit) than as-grown dry oxides. Dit was found to increase after post growth annealing in an inert ambient particularly for wet oxides. However, Dit was relatively insensitive to electrical stress for the range of fluence studied. The Dit spectrum of the wet oxide approached that of the dry oxide as the post-growth annealing temperature was increased, and no difference in Dit of wet and dry oxides was observed after a 1100 C/30 s anneal. In contrast, positive fixed charge density (Qf) was found to decrease with annealing temperature for both dry and wet oxides. This behavior is consistent with previous reported results. No observable effect of growth or annealing conditions on charge trapping properties was observed for any of the oxides.
  • Keywords
    annealing; interface states; oxidation; rapid thermal processing; 1100 C; SiO2; annealing; dry oxide; electrical stress; interface charge; interface trap density; positive fixed charge density; rapid thermal oxidation; wet oxide; Electric breakdown; Electric variables measurement; Electron traps; Heat treatment; Oxidation; Probes; Rapid thermal annealing; Rapid thermal processing; Temperature; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001
  • Print_ISBN
    0-9638251-0-4
  • Type

    conf

  • DOI
    10.1109/RTP.2001.1013779
  • Filename
    1013779