DocumentCode
1873757
Title
Effect of growth and annealing conditions on interface charge of dry and wet oxides grown using rapid thermal oxidation
Author
Sharangpani, R. ; Tay, Sing-Pin
Author_Institution
Mattson Thermal Products Inc., San Jose, CA, USA
fYear
2001
fDate
2001
Firstpage
273
Lastpage
286
Abstract
In this paper we compare fixed and interface trapped charges of dry and wet oxides processed under different conditions. As-grown wet oxides demonstrate a significantly lower density of interface traps (Dit) than as-grown dry oxides. Dit was found to increase after post growth annealing in an inert ambient particularly for wet oxides. However, Dit was relatively insensitive to electrical stress for the range of fluence studied. The Dit spectrum of the wet oxide approached that of the dry oxide as the post-growth annealing temperature was increased, and no difference in Dit of wet and dry oxides was observed after a 1100 C/30 s anneal. In contrast, positive fixed charge density (Qf) was found to decrease with annealing temperature for both dry and wet oxides. This behavior is consistent with previous reported results. No observable effect of growth or annealing conditions on charge trapping properties was observed for any of the oxides.
Keywords
annealing; interface states; oxidation; rapid thermal processing; 1100 C; SiO2; annealing; dry oxide; electrical stress; interface charge; interface trap density; positive fixed charge density; rapid thermal oxidation; wet oxide; Electric breakdown; Electric variables measurement; Electron traps; Heat treatment; Oxidation; Probes; Rapid thermal annealing; Rapid thermal processing; Temperature; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Thermal Processing of Semiconductors 9th Internationa Conference on RTP 2001
Print_ISBN
0-9638251-0-4
Type
conf
DOI
10.1109/RTP.2001.1013779
Filename
1013779
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