Multi-color imaging with silicon-on-insulator diode uncooled infrared focal plane array using through-hole plasmonic metamaterial absorbers

Author

Fujisawa, Daisuke ; Ogawa, Shinpei ; Hata, Hisatoshi ; Uetsuki, Mitsuharu ; Misaki, Koji ; Takagawa, Yousuke ; Kimata, Masafumi

Author_Institution

Mitsubishi Electr. Corp., Kamakura, Japan

fYear

2015

fDate

18-22 Jan. 2015

Firstpage

905

Lastpage

908

Abstract

This paper reports a silicon-on-insulator diode uncooled infrared focal plane array (IRFPA) with through-hole plasmonic metamaterial absorbers (TH-PLMAs) for multi-color imaging with a 320×240 array format. Through-holes formed on the PLMA can reduce the thermal mass while maintaining both the single-mode and high absorption due to plasmonic metamaterial structures, which results in fast response and high responsivity. The detection wavelength of the PLMA with through-holes can be controlled over a wide range of the IR spectrum by varying the size of the micropatches on the top layer.

Keywords

focal planes; image colour analysis; infrared spectra; metamaterials; plasmonics; semiconductor diodes; silicon-on-insulator; IR spectrum; IRFPA; Si; TH-PLMA; array format; micropatches; multicolor imaging; plasmonic metamaterial structures; silicon-on-insulator diode; thermal mass; through-hole plasmonic metamaterial absorbers; uncooled infrared focal plane array; Absorption; Etching; Imaging; Metamaterials; Plasmons; Silicon-on-insulator; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on

Conference_Location

Estoril

Type

conf

DOI

10.1109/MEMSYS.2015.7051106

Filename

7051106