DocumentCode
1875661
Title
Mechanical, Thermal, and Material Influences on Ohmic-Contact-Type MEMS Switch Operation
Author
McGruer, N.E. ; Adams, G.G. ; Chen, L. ; Guo, Z.J. ; Du, Y.
Author_Institution
Northeastern University, Boston, Massachusetts, USA
fYear
2006
fDate
2006
Firstpage
230
Lastpage
233
Abstract
Microswitch performance and reliability are affected by the coupled influences of actuator properties, material and process properties, and device thermal properties. Different contact materials show large differences in immunity to contamination. Contact shape and the adherence force between contact surfaces both evolve as the contact pair is cycled, with the adherence force often reaching a maximum between 105and 107cycles for gold. A typical switch actuation with a step function voltage results in an contact impact force 5 times greater than the static force, increasing the adherence force and the rate of change of the shape of the contact. Heating of the conductors in the switch results in intermodulation products, which are small at a transmitted power of 1 W, but increase with increasing power levels.
Keywords
Actuators; Contacts; Gold; Heating; Materials reliability; Microswitches; Shape; Surface contamination; Switches; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
Conference_Location
Istanbul, Turkey
ISSN
1084-6999
Print_ISBN
0-7803-9475-5
Type
conf
DOI
10.1109/MEMSYS.2006.1627778
Filename
1627778
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