• DocumentCode
    1875661
  • Title

    Mechanical, Thermal, and Material Influences on Ohmic-Contact-Type MEMS Switch Operation

  • Author

    McGruer, N.E. ; Adams, G.G. ; Chen, L. ; Guo, Z.J. ; Du, Y.

  • Author_Institution
    Northeastern University, Boston, Massachusetts, USA
  • fYear
    2006
  • fDate
    2006
  • Firstpage
    230
  • Lastpage
    233
  • Abstract
    Microswitch performance and reliability are affected by the coupled influences of actuator properties, material and process properties, and device thermal properties. Different contact materials show large differences in immunity to contamination. Contact shape and the adherence force between contact surfaces both evolve as the contact pair is cycled, with the adherence force often reaching a maximum between 105and 107cycles for gold. A typical switch actuation with a step function voltage results in an contact impact force 5 times greater than the static force, increasing the adherence force and the rate of change of the shape of the contact. Heating of the conductors in the switch results in intermodulation products, which are small at a transmitted power of 1 W, but increase with increasing power levels.
  • Keywords
    Actuators; Contacts; Gold; Heating; Materials reliability; Microswitches; Shape; Surface contamination; Switches; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19th IEEE International Conference on
  • Conference_Location
    Istanbul, Turkey
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-9475-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2006.1627778
  • Filename
    1627778