DocumentCode
1876300
Title
Graphene one-shot micro-valve: Towards vaporizable electronics
Author
Gund, V. ; Ruyack, A. ; Ardanuc, S. ; Lal, A.
Author_Institution
SonicMEMS Lab., Cornell Univ., Ithaca, NY, USA
fYear
2015
fDate
18-22 Jan. 2015
Firstpage
1090
Lastpage
1093
Abstract
One-shot micro-valves are key to applications that require leak-proof sealing of micro-cavities before they are irreversibly triggered to expose the cavity content to the outside environment. Here, we report a novel micro-scale one-shot valve made of graphene transferred on to silicon-nitride (SixNy) membranes. The valve triggers thermo-mechanically in 15.4±3.9 msec consuming 142.1±13.5 mW electrical power, corresponding to 2.2 mJ input energy. The valve membrane can sustain a differential pressure of 2 bars. The graphene serves multiple purposes in the device, acting as an atomically thin barrier to gas-diffusion, a resistive heater, and a source of stress in triggering the valve owing to its negative thermal expansion coefficient (TEC). The valve is designed to trigger and expose arrays of nanogram micro-packets of reactive alkali metal atoms such as rubidium, exposing it to atmospheric oxygen causing it generate heat. This heat can be used for massively parallel vaporization of vaporizable polymer electronics. A 1 mm3 Li-battery can trigger 1580 valves on a single chip for enabling transient electronics.
Keywords
graphene; microcavities; microvalves; seals (stoppers); silicon compounds; thermal expansion; Li-battery; SixNy; TEC; atmospheric oxygen; energy 2.2 mJ; gas-diffusion; graphene one-shot microvalve; microcavity leak-proof sealing; microscale one-shot valve; nanogram micropacket arrays; negative thermal expansion coefficient; parallel vaporization; pressure 2 bar; reactive alkali metal atoms; resistive heater; transient electronics; valve membrane; vaporizable polymer electronics; Cavity resonators; Graphene; Heating; Metals; Stress; Substrates; Valves;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2015 28th IEEE International Conference on
Conference_Location
Estoril
Type
conf
DOI
10.1109/MEMSYS.2015.7051153
Filename
7051153
Link To Document