• DocumentCode
    1876528
  • Title

    Dense photonics integration on a micron-scale SOI waveguide platform

  • Author

    Aalto, Timo ; Cherchi, Matteo ; Harjanne, Mikko ; Kapulainen, Markku ; Ylinen, Sami

  • Author_Institution
    VTT Tech. Res. Centre of Finland, Espoo, Finland
  • fYear
    2013
  • fDate
    28-30 Aug. 2013
  • Firstpage
    107
  • Lastpage
    108
  • Abstract
    Feasibility of micron-scale SOI waveguides for dense photonics integration is demonstrated. Compact circuits are obtained by applying multiple etching steps on 3-12 μm thick SOI layers. Optoelectronics is integrated on SOI using thermo compression bonding.
  • Keywords
    etching; integrated circuit bonding; integrated optoelectronics; optical waveguides; silicon-on-insulator; Si; compact circuits; dense photonic integration; etching; integrated optoelectronics; micron-scale SOI waveguide; size 3 mum to 12 mum; thermocompression bonding; thick SOI layers; Couplings; Optical losses; Optical waveguides; Photonics; Silicon; Silicon-on-insulator; Waveguide lasers; hybrid integration; photonic integrated circuit; silicon photonics; silicon-on-insulator; waveguide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
  • Conference_Location
    Seoul
  • ISSN
    1949-2081
  • Print_ISBN
    978-1-4673-5803-3
  • Type

    conf

  • DOI
    10.1109/Group4.2013.6644452
  • Filename
    6644452
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1876528