DocumentCode
187700
Title
Analysis of the reliability impact on high-k metal gate SRAM with assist-circuit
Author
Chiu, Y.T. ; Wang, Y.F. ; Lee, Young-Hyun ; Liang, Yung C. ; Wang, T.C. ; Wu, S.Y. ; Hsieh, C.C. ; Wu, Kaijie
Author_Institution
TQRD, Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
fYear
2014
fDate
1-5 June 2014
Abstract
Assist circuits for SRAM have become a foreseeable solution for Vmin improvement. In this work, we characterized SRAM Vmin behaviors with read-write assist circuit before and after high temperature operating life (HTOL) stress. Our study demonstrated that read assist with suppressed wordline design not only improved time zero SRAM Vmin window, but also benefited to relieve BTI induced Read Vmin degradation after HTOL as read assist alleviates read disturb and stabilizes read operation. However, the wordline voltage needs to adjust carefully to reduce write performance impact when turning on read assist. Write assist used in this study shows over 200mV improvement at time zero with negative bitline boost, we have also evaluated write assist negative bias window and verified no reliability concern with proper bias setting.
Keywords
SRAM chips; high-k dielectric thin films; integrated circuit reliability; negative bias temperature instability; BTI induced read Vmin degradation; HTOL; evaluated write assist negative bias window; high temperature operating life stress; high-k metal gate SRAM; negative bitline boost; read-write assist circuit; reliability impact analysis; suppressed wordline design; time zero SRAM Vmin window; wordline voltage; CMOS integrated circuits; Degradation; Integrated circuit reliability; Logic gates; Random access memory; Stress; Assist Circuit; HTOL; Reliability; SRAM; Vmin;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6861171
Filename
6861171
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