Characterization and processing of low dielectric constant thick film substrates for electronic packaging applications

Author

Kellerman, Dave ; Retherford, Larry ; Nabatian, David J. ; Bokalo, Peter ; He, Feng ; Barlow, Fred ; Elshabini, Aicha

Author_Institution

Lincoln Lab., MIT, Lexington, MA, USA

fYear

1998

fDate

15-18 Mar 1998

Firstpage

130

Lastpage

133

Abstract

The application of the new microsphere Low K thick film material to large MCM-C substrates is discussed in this paper. Processing of large ceramic boards approximately 6.5×8.5 inches square with 4 metal layers is described. Both screen printed and etched silver and gold metallizations are used for this work. Electrical, physical, and materials characterization of both silver and gold compatible multilayer Low K dielectric material is detailed. High frequency characterization of the material is also discussed, over a wideband frequency bandwidth between 1-12 GHz

Keywords

integrated circuit interconnections; integrated circuit packaging; multichip modules; permittivity; substrates; thick films; 6.5 inch; 8.5 inch; Ag; Au; assembly process compatibility; electrical characterization; electronic packaging applications; etched metallizations; high frequency characterization; large MCM-C substrates; large ceramic boards; low dielectric constant thick film substrates; materials characterization; microsphere low K thick film material; multilayer interconnect; physical characterization; screen printed metallizations; wideband frequency bandwidth; Ceramics; Dielectric constant; Dielectric materials; Dielectric substrates; Etching; Frequency; Gold; Metallization; Silver; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-4795-1

Type

conf

DOI

10.1109/ISAPM.1998.664448

Filename

664448