Packaging induced stresses in a packaged micromechanical microphone

Author

Rusanen, By Outi ; Torkkeli, Altti ; Vähäkangas, Jouko

Author_Institution

VTT Electron., Espoo, Finland

fYear

1998

fDate

15-18 Mar 1998

Firstpage

161

Lastpage

164

Abstract

The emergence of micromechanical components and systems offers a viable step towards miniaturisation of electronics products. VTT Electronics has developed a capacitive microphone that is manufactured using silicon micromachining. Die bonding to silicon substrate has shown to inflict only minor stresses to the microphone performance when an elastic silicone adhesive is used. Flip chip bonding will increase the amount of stresses, especially if the substrate material is not matched to silicon in its thermal expansion

Keywords

adhesion; capacitors; flip-chip devices; internal stresses; membranes; microassembling; microphones; microsensors; semiconductor device packaging; thermal expansion; thermal stresses; Si; capacitive microphone; die bonding; elastic silicone adhesive; flip chip bonding; miniaturisation; packaged micromechanical microphone; packaging induced stresses; polysilicon membranes; silicon micromachining; thermal expansion; Bonding; Electronics packaging; Flip chip; Manufacturing; Microassembly; Micromachining; Micromechanical devices; Microphones; Silicon; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-7803-4795-1

Type

conf

DOI

10.1109/ISAPM.1998.664454

Filename

664454