Power surface mount components for high reliability applications

Surface mount technology applications for power circuit assembly are discussed. In addition to discrete power surface mount components, it is also possible to purchase user-defined assemblies of power surface mount components which can be assembled using conventional discrete assembly techniques. These surface mount techniques have produced power supplies which are low profile with a high power density. In this work, the various power hermetic surface mount offerings are reviewed and compared to the conventional discrete and hybrid versions. In addition, the surface mount assembly process for these high-power components is reviewed, and the thermal and electrical requirements are discussed.<>