• DocumentCode
    1881592
  • Title

    Integration using the hybrid silicon platform

  • Author

    Bowers, John E. ; Chen, Hui-Wen ; Liang, Di ; Oakley, Douglas C. ; Napoleone, Antonio ; Chapman, David C. ; Chen, Chang-Lee ; Juodawlkis, Paul W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    A brief review of recent progress in photonic integrated circuits (PIC) and connection to the electronic IC roadmap is presented. High-quality wafer bonding, electrically pumped lasers and high speed modulators are essential technologies for high speed interconnects and mass production of optoelectronics.
  • Keywords
    electro-optical modulation; integrated optics; integrated optoelectronics; silicon; wafer bonding; Si; hybrid silicon platform; photonic integrated circuits; wafer bonding; Conducting materials; Consumer electronics; III-V semiconductor materials; Indium phosphide; Integrated circuit technology; Optical materials; Photonic integrated circuits; Silicon; Substrates; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Communication, 2009. ECOC '09. 35th European Conference on
  • Conference_Location
    Vienna
  • Print_ISBN
    978-1-4244-5096-1
  • Type

    conf

  • Filename
    5287048
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1881592