Development of robust hybrids for smart skin avionics

Author

Thomas, Terrance L.

Author_Institution

Boeing Military Airplanes, Seattle, WA, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

131

Abstract

The author presents the conceptualization of robust hybrids which are conformally integrated onto aircraft structure for structural health monitoring applications. The robust hybrid concept exhibits high-performance signal processing and uses advanced hybrid packaging technologies to satisfy conformal integration requirements. The author also discusses the basic issues and requirements of smart skin avionics. The predominant issues of smart skin avionics integration include the thermal management, interconnects and mechanical attachment of modular avionics onto aircraft structure. It is concluded that the development of robust hybrids for sensor processing could introduce smart skins technologies to future avionics systems

Keywords

aircraft instrumentation; hybrid integrated circuits; military equipment; modules; packaging; substrates; advanced hybrid packaging technologies; conformal integration requirements; high-performance signal processing; interconnects; mechanical attachment; modular avionics; robust hybrids; smart skin avionics; structural health monitoring; thermal management; Aerospace electronics; Aircraft; Intelligent sensors; Mechanical sensors; Monitoring; Packaging; Robustness; Signal processing; Skin; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122179

Filename

122179