DocumentCode
1884029
Title
New method of water cleaning for circuit substrates
Author
Takayama, N. ; Sugiyama, T. ; Takahashi, K.
Author_Institution
Shindengen Electr. Manuf. Co. Ltd., Saitama, Japan
fYear
1990
fDate
20-23 May 1990
Firstpage
228
Abstract
Water-soluble flux which has characteristics equivalent to those of rosin flux has been developed by improving its activator and rheological modifier. Cleaning equipment has also been developed. The method was applied to cleaning on-board power-supply products, and the products passed a 1500-h temperature-humidity-bias test. It was demonstrated that combining the water-soluble flux and the cleaning equipment can provide the same reliability of reflow-soldered product as that of the product processed by the conventional cleaning method using rosin flux and solvent
Keywords
environmental testing; hybrid integrated circuits; printed circuit manufacture; reliability; surface treatment; 1500 h; PCB manufacture; cleaning equipment; cleaning on-board power-supply products; environment protection; reflow-soldered product; reliability; temperature-humidity-bias test; water cleaning for circuit substrates; water-soluble flux; Assembly; Chemicals; Circuits; Cleaning; Electronics industry; Reflow soldering; Resins; Solvents; Testing; Water pollution;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122194
Filename
122194
Link To Document