• DocumentCode
    1884029
  • Title

    New method of water cleaning for circuit substrates

  • Author

    Takayama, N. ; Sugiyama, T. ; Takahashi, K.

  • Author_Institution
    Shindengen Electr. Manuf. Co. Ltd., Saitama, Japan
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    228
  • Abstract
    Water-soluble flux which has characteristics equivalent to those of rosin flux has been developed by improving its activator and rheological modifier. Cleaning equipment has also been developed. The method was applied to cleaning on-board power-supply products, and the products passed a 1500-h temperature-humidity-bias test. It was demonstrated that combining the water-soluble flux and the cleaning equipment can provide the same reliability of reflow-soldered product as that of the product processed by the conventional cleaning method using rosin flux and solvent
  • Keywords
    environmental testing; hybrid integrated circuits; printed circuit manufacture; reliability; surface treatment; 1500 h; PCB manufacture; cleaning equipment; cleaning on-board power-supply products; environment protection; reflow-soldered product; reliability; temperature-humidity-bias test; water cleaning for circuit substrates; water-soluble flux; Assembly; Chemicals; Circuits; Cleaning; Electronics industry; Reflow soldering; Resins; Solvents; Testing; Water pollution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122194
  • Filename
    122194