• DocumentCode
    1884042
  • Title

    Assessment of aqueous cleaning of PWAs with wave and reflow soldered components

  • Author

    Castelli, G. ; Specchiulli, G.

  • Author_Institution
    Telettra SpA Vimercate, Italy
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    236
  • Abstract
    The authors report results obtained using production machines in a test program that started in the first quarter of 1989. Chemical and physical evaluation of different kinds of commercial water-soluble solder creams and fluxes was first performed. Three products were selected and subjected to test in order to qualify their application in the professional field for wave soldering and reflow processes, and they were compared to the standard CFC (chlorofluorocarbon) cleaning procedure. Ionic contamination and THB (temperature-humidity-bias) tests were performed on ad hoc designed PWAs (printed wiring assemblies). It was found that acceptable cleanliness is obtained with water-soluble products provided that the washing machine has suitable spray pressure, nozzle angles, and drying section. Reliability tests on components are in progress to evaluate the possible detrimental effects of residual contaminants when moisture is present. Preliminary results of this step are given
  • Keywords
    printed circuit manufacture; surface treatment; PWAs; THB; acceptable cleanliness; aqueous cleaning; chemical evaluation; commercial water-soluble solder creams; drying section; ionic contamination; nozzle angles; physical evaluation; possible detrimental effects; printed wiring assemblies; production machines; reflow processes; reflow soldered components; residual contaminants; spray pressure; temperature-humidity-bias; test program; washing machine; water-soluble products; wave soldering; Assembly; Chemicals; Cleaning; Contamination; Performance evaluation; Production; Soldering; Testing; Washing machines; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122195
  • Filename
    122195