DocumentCode
1884734
Title
F1: Silicon 3D-integration technology and systems
Author
Urard, Pascal ; Takeuchi, Ken ; Bernstein, Kerry ; Hidaka, Hideto ; Phan, Michael ; Choi, Joo Sun ; Payne, Bob ; Stojanovic, Vladimir ; Berkel, Kees van ; Sakurai, Takayasu
Author_Institution
STMicroelectronics, Crolles, France
fYear
2010
fDate
7-11 Feb. 2010
Firstpage
510
Lastpage
511
Abstract
This whole-day forum offers a complete overview of the existing and emerging 3D-techniques enabling higher interconnectivity between circuit components. It aims to show the advantages of these techniques such as reduced cost, lower power consumption and ease of integration of new generations of System-in-Package (SiP). Designers face different problems which are specific to the application segments such as imagers, battery operated devices, SSD, etc. This forum looks into these problems and presents different 3D-solutions.
Keywords
Baseband; Batteries; CMOS technology; Cameras; Chip scale packaging; Circuit synthesis; Integrated circuit technology; Silicon; Stacking; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2010 IEEE International
Conference_Location
San Francisco, CA, USA
ISSN
0193-6530
Print_ISBN
978-1-4244-6033-5
Type
conf
DOI
10.1109/ISSCC.2010.5433859
Filename
5433859
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