Two phase cooling with heat transfer enhancement for BGA package

Boiling heat transfer enhancement for a two-phase cooling design is presented in this paper. The paper discusses an effective method of boiling heat transfer enhancement and its performance. The pool boiling heat transfer from the silicon surface is enhanced by combination of surface modification and micro machined structure. The effect of micro structure features like pore diameter, pore pitch, channel width, channel pitch on heat transfer enahcement has been investigated. Maximum of 300% higher heat flux is demonstrated with the enhancement structure. A compact two phase cooling solution for a BGA flip-chip package is developed and characterized. The enhancement structure is integrated with the two-phase cooling solution and its performance is reported.