Reduced order modeling of power electronics cabinet with double-sided cooling

Thermal control of power electronics cabinets requires thermal characterization under multiple length scales and transport modes. Detailed numerical calculations or measurements are often time consuming or simply unfeasible. An efficient multiscale thermal modeling methodology is proposed for electronic cabinets with hybrid liquid, forced air convection, and thermoelectric cooling. Compact models are developed for complex components such as air-cooled heat sinks, thermoelectric coolers, microchannel coolers, and liquid-to-air heat exchangers. These models are validated through detailed simulations or experimental measurements and utilized in system level simulation subsequently. Reduced order modeling based Proper orthogonal decomposition is used to model the full system. A combination of compact modeling at the component level and reduced order modeling at system level is achieved. Performance and limitations of this approach are addressed.