Physical aging and evolving mechanical behavior of underfill encapsulants

Microelectronic encapsulants exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. Such aging effects are exacerbated at higher temperatures typical of thermal cycling qualification tests for harsh environment electronic packaging. In this work, the material behavior changes occurring in flip chip underfill encapsulants (silica filled epoxies) have been characterized for isothermal aging at four different temperatures that are below, near, and above the Tg of the material. A microscale tension-torsion testing machine has been used to evaluate the uniaxial tensile stress-strain and creep behaviors of the underfill material at several temperatures, after various durations of environmental exposure. A novel method has been developed to fabricate underfill uniaxial test specimens so that they accurately reflect the encapsulant layer present in flip chip assemblies. Using the developed specimen preparation procedure, samples were prepared and isothermal aged for up to 6 months at 80, 100, 125, and 150degC. Stress-strain and creep tests were then performed on both non-aged and aged samples at several different temperatures (25, 50, 75, 100, 125, and 150degC). The changes in mechanical behavior were recorded for the various aging temperatures and durations of isothermal exposure.