DocumentCode
1887500
Title
The thermal benefits of diamond enhanced plastic packages for microwave applications
Author
Gomes-Casseres, M.
Author_Institution
Lockheed Martin Co., Sanders Associates Inc., Nashua, NH, USA
Volume
2
fYear
1998
fDate
7-12 June 1998
Firstpage
1099
Abstract
The superior material properties of diamond combined with the economics of plastic packaging provide the ultimate thermal management solution. A GaAs power amplifier dissipating 20 W has been demonstrated in a diamond enhanced plastic package. In addition, a dramatic improvement in the electrical performance of a coplanar flip chip MMIC in plastic has been achieved.
Keywords
MMIC; MMIC power amplifiers; diamond; flip-chip devices; integrated circuit packaging; plastic packaging; 20 W; GaAs; GaAs power amplifier; coplanar flip chip MMIC; diamond enhanced plastic packages; material properties; microwave applications; thermal benefits; thermal management; Assembly; Dielectric substrates; Flip chip; Gallium arsenide; Lead; MMICs; PHEMTs; Plastic integrated circuit packaging; Plastic packaging; Power amplifiers;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1998 IEEE MTT-S International
Conference_Location
Baltimore, MD, USA
ISSN
0149-645X
Print_ISBN
0-7803-4471-5
Type
conf
DOI
10.1109/MWSYM.1998.705185
Filename
705185
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