• DocumentCode
    1887693
  • Title

    Thermal analyses of confined cell design for phase change random access memory (PCRAM)

  • Author

    Small, Evan ; Sadeghipour, Sadegh M. ; Pileggi, Larry ; Asheghi, Mehdi

  • Author_Institution
    Mech. Eng. Dept., Stanford Univ., Stanford, CA
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    1046
  • Lastpage
    1054
  • Abstract
    This investigation is an effort to demonstrate the feasibility of confined cell design for a phase change random access memory (Ovonic Unified Memory, OUM) cell which benefits, respectively, from the low current and the simple fabrication process of a line memory cell and T- structure. Similar to OUM devices, the confined cell design is also highly scalable. The 2-D numerical simulation results of the programming process for confined cells show very high (104 - 105) reset/set resistance ratios. However, the proper selection of the reset current is very important for achieving a complete amorphization of the active region, free of crystalline regions. Formation of such crystalline residues can create low resistance paths for the electric current rendering unacceptably low reset/set resistance ratios (of order two) during read. Simple analytical expressions for the reset current and thermal tome constants of a confined cell were obtained using 2-D and 3-D heat conduction heat transfer analyses. The results agree well with those of 2-D thermal and crystallization modeling, which indicate that the analytical models can be used as a powerful preliminary design tool for PCRAM.
  • Keywords
    phase change materials; random-access storage; thermal analysis; confined cell design; phase change random access memory; thermal analyses; thermal tome constants; Amorphous materials; Analytical models; Crystallization; Electric resistance; Fabrication; Heat transfer; Nonvolatile memory; Numerical simulation; Phase change random access memory; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544378
  • Filename
    4544378