• DocumentCode
    1888092
  • Title

    Enhanced field emission from p-doped black silicon on pillar structures

  • Author

    Langer, C. ; Prommesberger, C. ; Lawrowski, R. ; Muller, F. ; Schreiner, R. ; Serbun, P. ; Muller, G.

  • Author_Institution
    Fac. of Gen. Sci. & Microsyst. Technol., OTH Regensburg, Regensburg, Germany
  • fYear
    2015
  • fDate
    13-17 July 2015
  • Firstpage
    104
  • Lastpage
    105
  • Abstract
    Aligned square arrays of black silicon (b-Si) on top of pillars were fabricated on p-type silicon substrate by a deep-etching step combined with a b-Si process. Two 10×10 arrays with pillar heights of 8 μm and 20 μm and one b-Si reference sample without pillars were investigated. Integral field emission (FE) measurements of the arrays yielded rather low onset-fields between 6.4 V/μm and 13.5 V/μm and field enhancement factors between 430 and 800. The I-V curves showed typical Fowler-Nordheim behavior for low fields, whereas a saturation region was observed at higher fields. The maximum integral current in the saturation region was 8 μA at a field of 20 V/μm. The stability of the emission current was investigated over 3 hours and revealed moderate fluctuations of ± 8% in the saturation region. Voltage scans showed well-aligned FE from nearly all pillars.
  • Keywords
    electrical conductivity; elemental semiconductors; etching; field emission; semiconductor growth; silicon; Fowler-Nordheim behavior; I-V curves; Si; deep-etching; emission current stability; field enhancement factors; integral current; integral field emission measurements; onset-fields; p-doped black silicon aligned square arrays; p-type silicon substrate; pillar heights; pillar structures; saturation region; size 20 mum; size 8 mum; voltage scans; Cathodes; Current measurement; Etching; Fabrication; Iron; Silicon; Vacuum technology; black silicon; field emission; field emitter array;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference (IVNC), 2015 28th International
  • Conference_Location
    Guangzhou
  • Print_ISBN
    978-1-4673-9356-0
  • Type

    conf

  • DOI
    10.1109/IVNC.2015.7225547
  • Filename
    7225547