• DocumentCode
    1888224
  • Title

    Enhanced field emission study of SnS/TiO2 nanocomposite

  • Author

    Patil, Girish P. ; Bagal, Vivekanand S. ; Chavan, Padmakar G. ; Suryawanshi, Sachin R. ; More, M.A.

  • Author_Institution
    Dept. of Phys., North Maharashtra Univ., Jalgaon, India
  • fYear
    2015
  • fDate
    13-17 July 2015
  • Firstpage
    116
  • Lastpage
    117
  • Abstract
    Synthesis of SnS/TiO2 nanocomposite was done by thermal evaporation method. The field emission characteristics have been investigated at room temperature. The field emission current density versus applied field (J-E) and emission current versus time (I-t) characteristics were measured in a planer diode configuration at the base pressure of 1 × 10-8 mbar. Turn-on field defined for the emission current density of 0.1μA/cm2 has been found to be 1.2 V/μm and upon the application of high applied electric field of 4.6 V/μm maximum current density of 0.454 mA/cm2 has been achieved. The I-t measurement has been studied at the preset of 1 μA emission current for the duration of 3 hr. Overall nature of emission current has been seen to stable for duration of measurement.
  • Keywords
    current density; evaporation; field emission; liquid phase deposition; nanocomposites; nanofabrication; nanowires; semiconductor materials; tin compounds; titanium compounds; I-t measurement; SnS-TiO2; emission current versus time characteristics; enhanced field emission; field emission current density; high applied electric field; maximum current density; nanocomposite synthesis; planer diode configuration; temperature 293 K to 298 K; thermal evaporation method; Current density; Nanotubes; Nanowires; Physics; Semiconductor device measurement; Temperature measurement; Field emission; Nanocomposite; Thermal Evaporation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Nanoelectronics Conference (IVNC), 2015 28th International
  • Conference_Location
    Guangzhou
  • Print_ISBN
    978-1-4673-9356-0
  • Type

    conf

  • DOI
    10.1109/IVNC.2015.7225553
  • Filename
    7225553