DocumentCode
1892040
Title
Wire bonding process control using fuzzy logic
Author
Kinnaird, Clark ; Khotanzad, Alireza
Author_Institution
Dept. of Electr. Eng., Southern Methodist Univ., Dallas, TX, USA
fYear
1997
fDate
6-8 Oct 1997
Abstract
This paper describes a method of setting parameters for the wire bonding process using a fuzzy logic controller. The design of the fuzzy engine and the development of rules based on operator experience are discussed. Bonded ball size and shear strength density are the specific characteristics controlled. Experimental testing with standard wire bonders has resulted in improved process control
Keywords
fuzzy control; knowledge based systems; lead bonding; mechanical variables control; process control; shape control; shear strength; size control; ball shape; bonded ball size; fuzzy engine design; fuzzy logic controller; membership functions; operator experience based rules; process control; shear strength density; wire bonding; Bonding processes; Fuzzy control; Fuzzy logic; Geometry; Guidelines; Mathematical model; Packaging machines; Process control; Temperature; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location
San Francisco, CA
Print_ISBN
0-7803-3752-2
Type
conf
DOI
10.1109/ISSM.1997.664512
Filename
664512
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