DocumentCode
1893492
Title
Characterization of electrical packages via simulation and measurement
Author
Luk, Timwah ; Hosseini, Mahdi
Author_Institution
National Semiconductor Corp., South Portland, ME, USA
fYear
1993
fDate
18-19 May 1993
Firstpage
162
Lastpage
165
Abstract
A methodology that makes use of the advantages of both electromagnetic simulation and measurement to characterize integrated circuit packages is presented. The advantages, limitations and procedures to improve the accuracy of both methods are discussed. Results from both methods are compared. An accurate prediction of circuit performance is achieved with packaging models generated by this methodology
Keywords
circuit analysis computing; inductance; integrated circuit technology; packaging; EM simulator VAMOM; accuracy; circuit performance; electrical package characterisation; electromagnetic simulation; inductance; integrated circuit packages; measurement; packaging models; Capacitance; Circuit simulation; Conductors; Electric variables measurement; Geometry; Inductance; Integrated circuit measurements; Integrated circuit packaging; Semiconductor device packaging; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial
Conference_Location
Research Triangle Park, NC
ISSN
0749-6877
Print_ISBN
0-7803-0990-1
Type
conf
DOI
10.1109/UGIM.1993.297015
Filename
297015
Link To Document