Microelectronic packaging technology transfer

Author

Rust, Carl A. ; Key, James

Author_Institution

CALCE Electron. Packaging Res. Center, Maryland Univ., College Part, MD, USA

fYear

1993

fDate

18-19 May 1993

Firstpage

10

Lastpage

16

Abstract

The appropriate and efficient technology transfer mechanism will vary, depending on individual company circumstances and needs. It is important for research organizations to have multiple mechanisms in place to meet the diverse needs of research sponsors. The Computer Aided Life Cycle Engineering Electronic Packaging Research Center (CALCE EPRC) at the University of Maryland has considerable experience in efficient technology transfer mechanisms. A comparative view of different mechanisms is discussed. The use of software as a primary technology transfer mechanism is addressed. The supplemental activities of CALCE EPRC are reported

Keywords

integrated circuit technology; packaging; technology transfer; CALCE EPRC; analysis program; computer aided life cycle engineering; design program; electronic packaging; microelectronic packaging technology transfer; primary technology transfer mechanism; research organizations; software; Companies; Computational modeling; Educational institutions; Electronic equipment; Electronics packaging; Government; Laboratories; Microelectronics; Personnel; Technology transfer;

fLanguage

English

Publisher

ieee

Conference_Titel

University/Government/Industry Microelectronics Symposium, 1993., Proceedings of the Tenth Biennial

Conference_Location

Research Triangle Park, NC

ISSN

0749-6877

Print_ISBN

0-7803-0990-1

Type

conf

DOI

10.1109/UGIM.1993.297045

Filename

297045