Preface

On behalf of the Organizing and Technical Committees, it is our pleasure to welcome you to the sixth international conference on "Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems" (EuroSimE 2005) held at the Radisson Hotel of Berlin, Germany, from April 18 to 20, 2005. The annual EuroSimE conference was created as the only international conference with focus on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, As background EuroSimE was initiated in 2000 by the COMPETE network, having substantial sponsorship from the European Commission, as a European event to meet the growing development needs of Microelectronics and Microsystems in the above disciplines. Since then, EuroSimE has gained worldwide appeal with participants from more than thlrty countries, spanning all continents, taking part, EuroSimE has become a fully sponsored IEEE - CPMT event.