• DocumentCode
    1894956
  • Title

    A locally cured polyimide-based humidity sensor with high sensitivity and high speed

  • Author

    Kim, Jae Sung ; Kwak, Ki-Young ; Kwon, Kwang-Ho ; Min, Nam-Ki ; Kang, Moon-Sik

  • Author_Institution
    Dept. of Control & Instrum. Eng., Korea Univ., Jochiwon
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    434
  • Lastpage
    437
  • Abstract
    A novel capacitive-type humidity sensor based on polyimide thin films locally cured using MEMS microhotplate was developed. The locally cured polyimide films have been characterized using infrared spectroscopy and compared to those of films cured using a conventional thermal process. The polyimide locally cured at temperature over 350degC for 1 hour was fully cured. There were no significant differences in the polyimide thin films between locally cured on microhotplate and cured in convection ovens. The measured sensitivity for a sensor with a 1400 aring-thick polyimide film is 0.78 pF/%RH. Measurements show an offset drift of less than 1% RH at 50% RH and 37degC, and a hysteresis of <0.6%RH over a range of 25-85% RH, and a time response of 2.5 s. These results can be attributed to both locally-cured polyimide and sensor design and show the possibility of locally-cured polyimide films as high-speed, high-sensitivity humidity sensors.
  • Keywords
    capacitive sensors; humidity sensors; infrared spectroscopy; microsensors; thin films; MEMS microhotplate; capacitive-type humidity sensor; infrared spectroscopy; locally cured polyimide-based humidity sensor; polyimide thin films; Capacitive sensors; Humidity; Infrared spectra; Micromechanical devices; Ovens; Polyimides; Sensor phenomena and characterization; Temperature sensors; Thin film sensors; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2008 IEEE
  • Conference_Location
    Lecce
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-2580-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2008.4716471
  • Filename
    4716471