DocumentCode
1895044
Title
Chapter 5, Modeling and characterization of solder joints
fYear
2005
fDate
18-20 April 2005
Firstpage
70
Lastpage
70
Keywords
Aging; Creep; Environmentally friendly manufacturing techniques; Lead; Life testing; Soldering; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502776
Filename
1502776
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