Creep of thermally aged SnAgCu-solder joints

Author

Wiese, S. ; Roellig, M. ; Wolter, K.-J.

Author_Institution

Lab. of Electron. Packaging, Dresden Univ. of Technol., Germany

fYear

2005

fDate

18-20 April 2005

Firstpage

79

Lastpage

85

Abstract

The scope of the paper is to present creep data that was obtained from different specimens. It will be shown that the creep behaviour of SnAgCu-solder differs by specimen size and its manufacturing conditions. The paper focuses on the change of creep behaviour as a consequence of thermal aging of the solder. It compares the creep behaviour in the as-cast condition of the alloy with that after thermal storage for 24 h, 168 h and 1176 h at a temperature of 125°C. In addition the paper will point out the effect of different pad metallizations onto creep properties. The paper provides constitutive models for SnAg- and SnAgCu-solders in dependence on the type of pad metallization and aging condition.

Keywords

ageing; creep; creep testing; reliability; solders; tin alloys; 1176 h; 125 C; 168 h; 24 h; SnAg; SnAgCu; as-cast condition; creep; manufacturing conditions; pad metallizations; solder joints; specimen size; thermal ageing; thermal storage; Aging; Creep; Electronic packaging thermal management; Electronics packaging; Metallization; Physics; Power system modeling; Soldering; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502778

Filename

1502778