Parameter optimization for wafer probe using simulation

This paper presents the parameter simulation for wafer probe test by FEA modeling with consideration of different probe over travel (OT) distances, different movements along the contact surface of probe and bond pad, different contact friction coefficients, different shapes of the probe tip and diameters. Our goal is to find an optimized solution for probe test that will minimize the stresses in the structure under the bond pad, and eliminate failures. In the probe test modeling, a non-linear finite element contact model is developed for different probe tip geometry shapes. In addition, comparison between probe test damage and wire bonding failure is made to show how the degree of damage to both probe test and wire bonding on the same bond pad structures.