DocumentCode
1895744
Title
Passive-silicon-carrier design and characteristics
Author
Schettler, H.
Author_Institution
IBM Lab., Boeblingen, Germany
fYear
1990
fDate
20-23 May 1990
Firstpage
559
Abstract
A silicon-on-silicon package for nine VLSI chips is presented. The carrier is especially designed to support the high-frequency current surges of complementary logic like CMOS or BiCMOS. It contains integrated decoupling capacitors and uses three layers of metal. The chips are mounted by controlled-collapse chip connection. A /370 processor containing nine CMOS chips has been assembled. Functionality and manufacturability have successfully been demonstrated
Keywords
CMOS integrated circuits; VLSI; packaging; /370 processor; BiCMOS; CMOS; VLSI chips; complementary logic; controlled-collapse chip connection; functionality; high-frequency current surges; integrated decoupling capacitors; manufacturability; passive-silicon-carrier design; Assembly; BiCMOS integrated circuits; CMOS logic circuits; CMOS process; Capacitors; Logic design; Manufacturing; Packaging; Surges; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ECTC.1990.122243
Filename
122243
Link To Document