Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results

Author

Guédon-Gracia, Alexandrine ; Roux, Pierre ; Woirgard, Eric ; Zardini, Christian

Author_Institution

ENSEIRB, Univ. Bordeaux 1, Talence, France

fYear

2005

fDate

18-20 April 2005

Firstpage

259

Lastpage

262

Abstract

Lead-free BGA assemblies are submitted to accelerated ageing test in order to determine the cycle number lead to the failure. The thermo-mechanical simulations are carried out on the assembly model in order to compute the strain energy density dissipated in the solder joints during the thermal cycles. Then the correlation between the experimentations and the simulations allows to predict the cycle number lead to the failure for another test.

Keywords

ageing; assembling; ball grid arrays; finite element analysis; materials testing; reliability; thermomechanical treatment; FE simulation; accelerated ageing test; assembly model; cycle number; lead-free BGA assembly; reliability analysis; solder joint; strain energy density; thermal cycle; thermomechanical simulation; Accelerated aging; Analytical models; Assembly; Computational modeling; Environmentally friendly manufacturing techniques; Iron; Joining processes; Lead; Life estimation; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502811

Filename

1502811