Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling

Numerical simulation techniques are used increasingly in the (re-)design of micro-electronics because of their time and cost saving potentials. The current paper describes the application of such techniques for analysing and improving the thermo-mechanical performance of an electronics assembly. An initial finite element model is implemented and its predictions are compared to measurements. Based on this comparison, the model is further refined by an improved assessment of the input to the model in the form of materials properties: the properties of the moulding compound, failure behaviour of the lead-compound interface and failure behaviour of the lead material itself. Finally an updated model is used to determine directions for improvement of the behaviour of the assembly design.