Improved 3D-nonlinear compact modelling for power components

Author

Habra, W. ; Tounsi, P. ; Dorkel, J.M.

Author_Institution

LAAS-CNRS, Toulouse, France

fYear

2005

fDate

18-20 April 2005

Firstpage

390

Lastpage

393

Abstract

In this paper we present a simple methodology for generating electro-thermal compact models of electronics components, taking into account the 3D effects of the heat transfer, moreover, the grand challenge in our model is that it considers the effect of the nonlinearity of parameters like thermal conductivity. The generated model is a thermal network of resistances and capacitances which enables us to get the real changes of temperature by an electrical simulator (P-Spice), and so we can make full electro-thermal coupling in one step simulation process.

Keywords

SPICE; heat transfer; integrated circuit modelling; power electronics; thermal conductivity; transient response; 3D nonlinear compact modelling; P-Spice; electrical simulator; electro-thermal compact models; electronics component models; full electro-thermal coupling; heat transfer; integrated circuit modelling; one step simulation process; power components; power electronics; thermal conductivity; thermal network; transient response; Boundary conditions; Electronic components; Electronic packaging thermal management; Nonlinear equations; Silicon; Steady-state; Temperature; Thermal conductivity; Thermal resistance; Transient response;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502835

Filename

1502835