Thermal analysis of power MOSFETs using Rebeca-3D thermal modeling software (from Epsilon Ingenierie) versus physical measurements and possible extractions

Shrinking semiconductor packages, increasing die densities, process changes, and the requirements for optimizing electro-mechanical assemblies are making sound thermal designs more important than ever. Depending on the application scenario, thermal considerations can be approached from two angles. Rebeca-3D, a semi-FEA based software tool, provides the ability to develop a thermal model using detailed device geometry and material characteristics. The tool´s versatility allows it to be used to analyze a design in a range of application scenarios. Using this platform, this paper discusses actual examples of thermal model development and results. The results are first validated by comparing with datasheet information and experiments in an application lab. Following simulation, the platform is used to extrapolate the measurements done in the application lab. The results enable development of thermal performance profiles for different packages and for different electrical and assembly conditions. Several examples are discussed with figures and pictures. The study compares the results of simulations and tests on actual devices.