• DocumentCode
    1896611
  • Title

    Transient hygrothermal behaviour of portable electronics

  • Author

    Punch, Jeff ; Grimes, Ronan ; Heaslip, Greg ; Galkin, Timo ; Väkeväinen, Kyösti ; Kyyhkynen, Vesa ; Elonen, Erkko

  • Author_Institution
    Dept. of Mech. & Aeronaut. Eng., Limerick Univ., Ireland
  • fYear
    2005
  • fDate
    18-20 April 2005
  • Firstpage
    398
  • Lastpage
    405
  • Abstract
    The theme of this paper is the design of portable electronic systems for hot and humid conditions. In particular, portable products such as mobile phones. CD players and digital cameras can experience high relative humidity and condensation. It is important to understand the behaviour of portable products in different usage environments in order to develop more accurate specifications, simulation models and verification methods. In this paper, the response of portable electronics to time-varying conditions of temperature and humidity is considered in order to assess the conditions likely to precipitate condensation. A first-order coupled hygrothermal model is developed to represent the response of a typical portable product to variations in ambient temperature and humidity. Simple time constants are derived to describe transient hygrothermal response. Experimental characterisation of a sample product is performed to evaluate the parameters of the model, and it is demonstrated how movement from one environment to another can induce condensation to occur on the internal and external surfaces of a portable product.
  • Keywords
    heat transfer; mass transfer; thermal management (packaging); CD players; ambient temperature; condensation; digital camera; external surface; first-order coupled hygrothermal model; internal surface; mobile phones; portable electronics; relative humidity; time-varying condition; transient hygrothermal behaviour; Absorption; Acceleration; Corrosion; Heat transfer; Humidity; Predictive models; Surface resistance; Temperature; Thermal factors; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
  • Print_ISBN
    0-7803-9062-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2005.1502837
  • Filename
    1502837