DocumentCode
1897203
Title
Computer assisted design study of a low-cost pressure sensor
Author
Meuwissen, M.H.H. ; Veninga, B.P. ; Tijdink, M.W.W.J. ; Meijerink, M.G.H.
Author_Institution
TNO Sci. & Ind., Eindhoven, Netherlands
fYear
2005
fDate
18-20 April 2005
Firstpage
516
Lastpage
523
Abstract
The application of numerical techniques for the design of a low cost pressure sensor is described. The numerical techniques assist in addressing issues related to the thermo-mechanical performance of the sensor. This comprises the selection of the materials and dimensions used for the sensor itself and the substrate on which it is mounted. Moreover, simulations are applied to aid in the selection of suitable solder interconnect materials and dimensions. Where possible, the accuracy of the numerical predictions is assessed by comparing them to experiments on physical prototypes. The application of numerical simulations allowed for a reduction in the number of physical tests and thereby a reduction in design time and costs.
Keywords
ceramic packaging; cost optimal control; microsensors; numerical analysis; pressure sensors; reliability; solders; surface mount technology; thermal management (packaging); computer assisted design; pressure sensor; solder interconnect; thermomechanical performance; Acoustic sensors; Biomembranes; Costs; Dielectric substrates; Mechanical sensors; Prototypes; Silicon; Temperature sensors; Thermal sensors; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502860
Filename
1502860
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