• DocumentCode
    1897203
  • Title

    Computer assisted design study of a low-cost pressure sensor

  • Author

    Meuwissen, M.H.H. ; Veninga, B.P. ; Tijdink, M.W.W.J. ; Meijerink, M.G.H.

  • Author_Institution
    TNO Sci. & Ind., Eindhoven, Netherlands
  • fYear
    2005
  • fDate
    18-20 April 2005
  • Firstpage
    516
  • Lastpage
    523
  • Abstract
    The application of numerical techniques for the design of a low cost pressure sensor is described. The numerical techniques assist in addressing issues related to the thermo-mechanical performance of the sensor. This comprises the selection of the materials and dimensions used for the sensor itself and the substrate on which it is mounted. Moreover, simulations are applied to aid in the selection of suitable solder interconnect materials and dimensions. Where possible, the accuracy of the numerical predictions is assessed by comparing them to experiments on physical prototypes. The application of numerical simulations allowed for a reduction in the number of physical tests and thereby a reduction in design time and costs.
  • Keywords
    ceramic packaging; cost optimal control; microsensors; numerical analysis; pressure sensors; reliability; solders; surface mount technology; thermal management (packaging); computer assisted design; pressure sensor; solder interconnect; thermomechanical performance; Acoustic sensors; Biomembranes; Costs; Dielectric substrates; Mechanical sensors; Prototypes; Silicon; Temperature sensors; Thermal sensors; Thermomechanical processes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
  • Print_ISBN
    0-7803-9062-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2005.1502860
  • Filename
    1502860