Extending the limits of air-cooling in microelectronic equipment

Author

Rodgers, Peter ; Eveloy, Valérie ; Pecht, Michael G.

Author_Institution

CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA

fYear

2005

fDate

18-20 April 2005

Firstpage

695

Lastpage

702

Abstract

Despite the perception that the limits of air-cooling have been reached, this paper reviews approaches that could maintain the effectiveness of this technology. Key thermal management areas that need to be addressed are discussed, including heat sink design and analysis, interface thermal resistance minimization, heat spreading, fan performance, hybrid thermal management, heat sink surface fouling, and sustainability.

Keywords

heat sinks; integrated circuits; nanotechnology; thermal management (packaging); thermal resistance; air-cooling; fan performance; heat sink analysis; heat sink design; heat sink surface fouling; heat spreading; hybrid thermal management; interface thermal resistance minimization; microelectronic equipment; Educational institutions; Electronics cooling; Heat sinks; Heat transfer; Microelectronics; Resistance heating; Surface resistance; Thermal management; Thermal management of electronics; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on

Print_ISBN

0-7803-9062-8

Type

conf

DOI

10.1109/ESIME.2005.1502891

Filename

1502891