• DocumentCode
    1899374
  • Title

    Very thin SiC membranes for micromachined vacuum sensors

  • Author

    Pham, H.T.M. ; Fan, C. ; Pandraud, G. ; Creemer, F. ; Sarro, P.M. ; van der Pers, N.M. ; Visser, Paul ; Kwakernaak, K.

  • Author_Institution
    ECTM/DIMES, Delft Univ. of Technol., Delft
  • fYear
    2008
  • fDate
    26-29 Oct. 2008
  • Firstpage
    1143
  • Lastpage
    1146
  • Abstract
    Very thin (20-200 nm) SiC membranes with controlled composition and thickness, low tensile stress, layer continuity and etching selectivity are fabricated using a specially developed LPCVD process. These characteristics are necessary for their application in vacuum sensors, especially for operation in harsh environment. The continuity, low stress (180 MPa) and etching selectivity in combination with the reduced thickness increase the sensor sensitivity. Full characterization of these membranes is performed to investigate their structural and mechanical properties and fine tune them according to the application specific requirements. The fabricated membranes have undergone a bulge test in a system that can generate up to 1bar pressure. The largest size tested (800 mum times 600 mum) can withstand a maximum pressure of 780 mbar, while the smaller membranes did not break even for the maximum pressure our test system supplies.
  • Keywords
    membranes; microsensors; silicon compounds; LPCVD process; SiC membranes; etching selectivity; layer continuity; micromachined vacuum sensors; sensor sensitivity; tensile stress; Biomembranes; Etching; Mechanical factors; Mechanical sensors; Sensor phenomena and characterization; Silicon carbide; Stress control; System testing; Tensile stress; Thickness control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2008 IEEE
  • Conference_Location
    Lecce
  • ISSN
    1930-0395
  • Print_ISBN
    978-1-4244-2580-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2008.4716643
  • Filename
    4716643