• DocumentCode
    190001
  • Title

    Comparison of polypropylene and FR4 dielectric cavity for RLSA antenna design at 5.8GHz

  • Author

    Ibrahim, I.M. ; Rahman, T.A. ; Sabran, M.I. ; Jamlos, M.F.

  • Author_Institution
    Fac. of Electron. & Comput. Eng., Univ. Teknikal Malaysia, Melaka, Malaysia
  • fYear
    2014
  • fDate
    14-16 April 2014
  • Firstpage
    232
  • Lastpage
    234
  • Abstract
    The Radial Line Slot Array (RLSA) Antenna is very pleasing due to low profile appearance and high gain characteristic. Recent research on RLSA is to produce a light weight, durable and easy fabrication process. Thus, FR4 is an alternative substrate to replace the polypropylene. This paper presents a comparison of polypropylene and FR4 dielectric substrate for linear polarized Radial Line Slot Array (RLSA) antenna at 5.8 GHz frequency. Both antennas implemented the same radiating slot design in an antenna with diameter of 200mm. The results show an improvement of radiation pattern using FR4 dielectric substrate as compare to polypropylene dielectric base. However, the reflection coefficient for polypropylene substrate show specific resonant at 5.8GHz frequency while FR4 substrate introduce multiple resonant. This paper also suggested FR4 board can be a potential substrate and major component for RLSA antenna development in future.
  • Keywords
    antenna radiation patterns; microwave antennas; slot antenna arrays; FR4 board; FR4 dielectric cavity; FR4 dielectric substrate; FR4 substrate; RLSA antenna; RLSA antenna design; RLSA antenna development; fabrication process; frequency 5.8 GHz; linear polarized radial line slot array; polypropylene comparison; polypropylene dielectric base; polypropylene substrate; profile appearance; radial line slot array; radiating slot design; radiation pattern; reflection coefficient; size 200 mm; Antenna radiation patterns; Arrays; Cavity resonators; Dielectrics; Slot antennas; Substrates; FR4 substrate; RLSA antenna; polypropylene substrate; slot antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Region 10 Symposium, 2014 IEEE
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4799-2028-0
  • Type

    conf

  • DOI
    10.1109/TENCONSpring.2014.6863032
  • Filename
    6863032