Micro-Transfer-Printing: Heterogeneous integration of microscale semiconductor devices using elastomer stamps

Micro-transfer-printing is an emerging method to accurately assemble microscale semiconductor devices onto non-native substrates. In micro-transfer-printing an engineered elastomer stamp coupled to a precision motion controller is utilized to pick-up and transfer arrays of microscale devices. A wide range of materials and devices have been micro-transfer-printed, including; Silicon integrated circuits, Gallium Arsenide LEDs, Gallium Arsenide solar cells, Gallium Arsenide lasers and Gallium Nitride LEDs. Devices compatible with micro-transfer-printing are very thin (<; 10 microns) and small (<; 100um lateral dimensions) and are ideally suited for making flexible device formats and are also well-suited for wafer-level heterogeneous integration. Here, we review the state-of-the art in Micro-Transfer-Printing and also present Micro-Transfer-Printing as a cost-effective approach to heterogeneous integration of compound semiconductor sensors.