Through-Silicon Via Technologies for Extreme Miniaturized 3D Integrated Wireless Sensor Systems (e-CUBES)

Fraunhofer IZM introduced a 3-D integration process, the so-called ICV-SLID technology based on inter-chip vias through the device substrates (through silicon vias) and metal bonding using solid-liquid-interdiffusion (SLID) soldering for simultaneous mechanical and the electrical connection [1]. The ICV-SLID technology is optimized for 3D integration of e-CUBES processing units, while interconnection techniques by hollow vias and Au stud bumps are used for stacking of sensor devices to the 3D-IC.