• DocumentCode
    1905273
  • Title

    High-density, high speed, board-to-board stripline connector

  • Author

    Sucheski, Matthew M. ; Glover, Douglas W.

  • Author_Institution
    AMP Inc., Harrisburg, PA, USA
  • fYear
    1990
  • fDate
    20-23 May 1990
  • Firstpage
    860
  • Abstract
    The AMP Mini-TBC stripline connector is described. This connector embodies a concept which approaches homogeneity across the connection of two printed circuit cards. Stripline characteristics of the board are maintained through the connector and make the connector virtually transparent to the circuit. As a result of contact miniaturization, spacing is maintained at 0.100-in centerlines, and the application of the product requires little change on the part of printed circuit board designers and fabricators. The electrical commoning of alternate columns of contacts provides economical application in environments where shielding is of paramount importance. In situations requiring district power distribution and a low-inductance path to ground, sufficient bulk is provided to conduct 1.5 A continuously (28 A per 20-column module, per power blade). Mechanical staging of ground, power, and signal contacts is generously set at 0.062-in nominal with 0.100 in of nominal wipe on the signal pin. This stripline connector offers the systems designer a cost-effective solution for applications requiring stripline performance at sub-nanosecond edge speed
  • Keywords
    electric connectors; printed circuit accessories; shielding; strip line components; 1.5 A; 28 A; AMP; Mini-TBC; PC cards; PCB; board-to-board connector; high density connector; high speed; printed circuit board; printed circuit cards; shielding; stripline connector; sub-nanosecond edge speed; Backplanes; Connectors; Crosstalk; Impedance; Information processing; Integrated circuit interconnections; Manufacturing processes; Nanoscale devices; Signal design; Stripline;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1990. ., 40th
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ECTC.1990.122289
  • Filename
    122289